Tokyo, Japan

Tsubasa Obata

USPTO Granted Patents = 13 

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2016-2025

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13 patents (USPTO):Explore Patents

Title: The Innovative Mind of Tsubasa Obata

Introduction: Tsubasa Obata, an accomplished inventor based in Tokyo, Japan, has made significant strides in the field of wafer processing technology. With a remarkable portfolio of 12 patents, he has established himself as a key player in the industry, particularly through his contributions to laser cutting and workpiece processing methods.

Latest Patents: Among his latest innovations, Obata developed a method of dicing a wafer by pre-sawing and subsequent laser cutting. This wafer processing technique includes several steps: placing a protective member on the face side of the wafer, grinding the reverse side to thin it, aligning a cutting blade to create cut grooves, and applying a laser beam to sever the wafer precisely along the projected dicing lines into individual device chips. Another notable patent is a workpiece processing method for a plate-shaped workpiece featuring a transparent substrate. This involves stacking resin layers and utilizing laser irradiation to remove segments of the first resin layer along planned dividing lines, creating a modified layer with unique properties.

Career Highlights: Currently, Tsubasa Obata holds a distinguished position at Disco Corporation, where he focuses on advancing wafer processing technologies. His innovative methods have not only enhanced production efficiency but also improved the precision of cutting operations, making him a respected figure in the realm of semiconductor manufacturing.

Collaborations: At Disco Corporation, Obata collaborates with talented coworkers like Yuki Ogawa and Yohei Yamashita. Together, they share insights and expertise that foster a creative environment, propelling further innovations in wafer processing and related fields.

Conclusion: Tsubasa Obata's dedication to innovation and excellence in wafer processing is evident through his numerous patents and contributions to Disco Corporation. His work continues to shape the future of semiconductor technology, paving the way for more efficient and precise manufacturing processes.

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