The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jul. 13, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Tsubasa Obata, Tokyo, JP;

Satoshi Kumazawa, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); C03B 33/033 (2006.01); C03B 33/02 (2006.01); C03B 33/07 (2006.01); B23K 26/364 (2014.01); B23K 26/00 (2014.01); B23K 26/08 (2014.01); H01L 23/15 (2006.01); B23K 26/402 (2014.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01); B23K 101/42 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4846 (2013.01); B23K 26/0006 (2013.01); B23K 26/08 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); C03B 33/0222 (2013.01); C03B 33/033 (2013.01); C03B 33/07 (2013.01); C03B 33/074 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); B23K 2103/172 (2018.08); B23K 2103/42 (2018.08); B23K 2103/54 (2018.08); H01L 23/49822 (2013.01);
Abstract

In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points.


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