The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2016

Filed:

Jul. 21, 2015
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Kensuke Nagaoka, Tokyo, JP;

Yuki Ogawa, Tokyo, JP;

Tsubasa Obata, Tokyo, JP;

Yuri Ban, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6836 (2013.01); H01L 22/12 (2013.01);
Abstract

A wafer has a substrate, a functional layer and division lines. The wafer is held on a chuck table with a protective member attached to the front side of the functional layer in contact with the chuck table. The height of the back side of the wafer is detected in a Z direction along each division line while moving the chuck table in an X direction. An X coordinate is recorded for each division line, as well as a corresponding Z coordinate. A cutting blade is positioned on the back side of the wafer and moved in the Z direction according to the recorded X and Z coordinates while moving the chuck table in the X direction to thereby form a cut groove having a depth not reaching the functional layer, with a part of the substrate left between the bottom of the cut groove and the functional layer.


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