Company Filing History:
6 out of 7,082 
1 out of 130 Years Active: 2000-2005
Title: Tsing-Fong Hwang: An Innovative Inventor from Tainan
Introduction:
Tsing-Fong Hwang is a notable inventor based in Tainan, Taiwan, recognized for his significant contributions to the field of semiconductor technology. With a portfolio of six patents, he has consistently pushed the boundaries of innovation, particularly in interconnect structures.
Latest Patents:
Among his latest patents is the invention of an interconnect structure with enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same. This innovative interconnect is formed on a substrate and includes a first conductive structure and a second conductive structure that have a gap region in-between. The notable aspects of this invention include a structured dielectric layer formed over the substrate, featuring a void at the gap region that significantly extends to the whole gap region. The design ensures a substantially planar surface, incorporating an anti-etch layer that effectively manages alignment during manufacturing processes. This contribution is pivotal in addressing challenges in semiconductor design and fabrication.
Career Highlights:
Throughout his career, Tsing-Fong Hwang has been associated with major companies in the semiconductor industry, including United Microelectronics Corporation and United Semiconductor Corporation. His work in these organizations has played a crucial role in advancing semiconductor technologies and enhancing device performance.
Collaborations:
Tsing-Fong Hwang has had the opportunity to collaborate with esteemed colleagues such as Ellis Lee and Tsung-Yuan Hung. These partnerships have fostered an environment of innovation, allowing for the exchange of ideas and expertise that further enhance the advancements in their field.
Conclusion:
In conclusion, Tsing-Fong Hwang exemplifies the spirit of innovation and dedication within the technology sector. His patents, particularly in interconnect structures, illustrate his commitment to solving complex engineering problems and pushing the limits of what is possible in semiconductor technology. His career and collaborations highlight the importance of teamwork and shared knowledge in driving forward technological advancements.