Hsinchu, Taiwan

Tse-Wei Wang


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020-2025

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5 patents (USPTO):Explore Patents

Hello! It's fascinating to delve into the world of innovation and inventions. Let's shine a light on the remarkable inventor Tse-Wei Wang from Hsinchu, Taiwan, known for his groundbreaking work in the field of manufacturing methods for carrier structures.

Title: Unveiling the Genius of Tse-Wei Wang: Pioneer in Manufacturing Method of Carrier Structures

Introduction: Tse-Wei Wang, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the realm of technology with his inventive manufacturing methods for carrier structures. His creative prowess has been manifested in numerous patents that have reshaped the landscape of electronic circuitry.

Latest Patents:

1. **Manufacturing Method of Carrier Structure:** Wang's innovative method involves the formation of a build-up circuit layer on a carrier, incorporating first and second circuit layers, dielectric layers, and conductive vias. This patent revolutionizes the manufacturing process of carrier structures, enhancing efficiency and performance in electronic devices.

2. **Carrier Structure and Manufacturing Method Thereof:** This patent showcases Wang's ingenuity in designing a carrier structure with a build-up circuit layer, featuring multiple circuit layers, dielectric layers, and conductive vias. The precision and complexity of this design underscore Wang's proficiency in advanced technological solutions.

Career Highlights: Tse-Wei Wang is associated with the esteemed Unimicron Technology Corporation, a prominent player in the technology sector renowned for its innovative solutions and cutting-edge technologies. Wang's affiliation with this esteemed company underscores his dedication to driving technological advancements and pushing the boundaries of innovation.

Collaborations: In his quest for innovation, Wang has collaborated with notable professionals in the field, including Cheng-Ta Ko and Tzyy-Jang Tseng. Together, they have synergized their expertise to develop groundbreaking technologies and propel the industry forward.

Conclusion: Tse-Wei Wang's inventive spirit and technical acumen have positioned him as a trailblazer in the realm of manufacturing methods for carrier structures. His patents stand as a testament to his visionary approach and unwavering commitment to advancing technology. Wang's contributions continue to inspire and shape the future of electronic engineering, solidifying his legacy as a pioneering inventor in the digital age.

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