Unimicron Technology Corporation

Mediatek Corporation

Tse-Wei Wang

Cheng-Ta Ko

Tzyy-Jang Tseng

Pu-Ju Lin

Yu-Cheng Chen

Ra-Min Tain

Guang-Hwa Ma

Chih-Chieh Wang

Wen-Yu Lin

Jun-Ho Chen

An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board. The circuit structure is disposed on an upper surface of the interposer substrate and electrically connected to the coaxial conductive element.

Electronic package structure and manufacturing method thereof

A method of synchronization in a training state of Universal Serial Bus (USB) includes sending SLOS1 ordered sets by a transmitter in a LOCK1 state, receiving the SLOS1 ordered sets by a receiver in the LOCK1 state, stopping the transmitter from sending training ordered sets according to a lane adapter state machine (LASM) if the transmitter sends the training ordered sets in the LOCK1 state continuously in an infinite loop. The training ordered sets include the SLOS1 ordered sets. The method further includes sending new SLOS1 ordered sets by the transmitter, receiving the new SLOS1 ordered sets by a receiver, and the transmitter and the receiver entering a LOCK2 state. The length of the new SLOS1 ordered sets is different from the length of the SLOS1 ordered sets.

Method of synchronization for universal serial bus and system thereof

A manufacturing method of a carrier structure includes: A build-up circuit layer is formed on a carrier. The build-up circuit layer includes at least one first circuit layer, at least one first dielectric layer, a second circuit layer, a second dielectric layer, and a plurality of conductive vias. The first circuit layer is located on the carrier and includes at least one first pad, which is disposed relative to at least one through hole of the carrier. The first dielectric layer is located on the first circuit layer. The second circuit layer is located on the first dielectric layer and includes at least one second pad. The second dielectric layer is located on the second circuit layer and includes at least one opening exposing the second pad. The conductive via penetrates the first dielectric layer and is electrically connected to the first circuit layer and the second circuit layer.

Manufacturing method of carrier structure

A carrier structure includes a carrier having at least one through hole penetrating the carrier and a build-up circuit layer located on the carrier and including at least one first circuit layer, at least one first dielectric layer, a second circuit layer, a second dielectric layer, and a plurality of conductive vias. The first circuit layer is located on a first surface of the carrier and includes at least one first pad disposed relative to the through hole. The first dielectric layer is located on the first circuit layer. The second circuit layer is located on the first dielectric layer and includes at least one second pad. The second dielectric layer is located on the second circuit layer and includes at least one opening exposing the second pad. The conductive vias penetrate the first dielectric layer and are electrically connected to the first and second circuit layers.

Carrier structure and manufacturing method thereof

A touch-sensing display panel includes a substrate, a first circuit layer, a LED chip, a second circuit layer, a blocking wall, a second wire, and a third wire. The first circuit layer is on the substrate, including at least one first electrode, and a first wire. The LED chip is on and electrically connected to the first electrode. The second circuit layer is on the first circuit layer, including a second electrode, a touch sensing line, and a touch driving line. The blocking wall, the second wire, and the third wire are on the second circuit layer. The second wire extends to an inner sidewall and a top surface of the blocking wall, and electrically connects to the touch sensing line. The third wire extends to an outer sidewall of the blocking wall, and electrically connects to the touch driving line.

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Hsinchu, Taiwan

Tse-Wei Wang