Tse E Wong

Title: The Innovations of Tse E Wong: Advancements in Microelectronic Thermal Interfaces

Introduction

Tse E Wong, an inventive mind based in Los Alamitos, California, has made significant contributions to the field of microelectronics through his ten patented inventions. His work primarily focuses on improving thermal interface structures and sealed packages for semiconductor devices, addressing issues such as heat dissipation and mechanical strain.

Latest Patents

Among his latest patents, Wong has introduced a mechanically improved microelectronic thermal interface structure designed for low die stress. This innovation features a thermal mount comprising multiple pillars, each with an aspect ratio greater than 2:1, strategically positioned to connect to various connection areas on the semiconductor integrated circuit die. The unique thermal conductivity of the materials utilized—specifically copper and copper nanoparticle layers—ensures a high performance at over 100 Watts per meter degree Kelvin (W/m·K). Moreover, the flexure of these pillars effectively accommodates mechanical strain arising from thermal changes.

Another notable invention is the hermetically sealed package featuring a stress-reducing layer. This sealed package consists of a device located on a wafer structure, which is bonded to a lid. The construction includes a metal ring with a stress relief buffer layer possessing greater ductility than the wafer surface, enhancing the durability and performance of the package by managing thermal expansion discrepancies.

Career Highlights

Tse E Wong has amassed a wealth of experience working at prominent companies such as Raytheon Company and Kelvin Thermal Technologies, Inc. His expertise in microelectronics has been instrumental in driving innovations that improve the quality and efficiency of semiconductor devices.

Collaborations

Throughout his career, Wong has collaborated with esteemed professionals in the field, including Mark S Hauhe and Clifton Quan. Their combined efforts have led to breakthroughs in thermal interface structures, emphasizing the importance of teamwork in driving technological advancements.

Conclusion

Tse E Wong stands out as a pivotal figure in microelectronics innovation. His dedication to creating advanced thermal interface solutions and sealing technologies not only reflects his prowess as an inventor but also contributes to the ongoing evolution of the semiconductor industry. With ten patents to his name, Wong's work positions him at the forefront of engineering excellence.