The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jun. 30, 2015
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Tse E. Wong, Los Alamitos, CA (US);
Kenneth T. Teshiba, Torrance, CA (US);
Shea Chen, Plano, TX (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 35/26 (2006.01); C22C 11/06 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B23K 35/262 (2013.01); B23K 35/268 (2013.01); C22C 11/06 (2013.01); C22C 13/00 (2013.01); H01L 23/49827 (2013.01); H01L 24/80 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01); H05K 3/4061 (2013.01); H05K 1/141 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/2081 (2013.01);
Abstract
An adaptive interposer is provided to be operably disposable between first and second solder materials of first and second electronic devices, respectively. The adaptive interposer includes a plate element formed to define cavities and third solder material disposable in the cavities to be electrically communicative with the first and second solder materials. The third solder material is more compliant and has a higher melting temperature than at least the second solder materials.