Company Filing History:
Years Active: 2010-2019
Title: Trung Duong: Innovator in Semiconductor Packaging
Introduction
Trung Duong is a notable inventor based in Austin, Texas, recognized for his contributions to semiconductor packaging technology. With a total of four patents to his name, he has made significant advancements in the field, particularly in the design and fabrication of semiconductor devices.
Latest Patents
Trung Duong's latest patents include innovative solutions for semiconductor packaging. One of his patents focuses on a package with a support structure, which details a semiconductor device that includes a semiconductor die and a redistribution layer (RDL) structure. This RDL structure features multiple contact pads and external connections, along with a support structure designed to enhance the device's stability. Another significant patent addresses wafer level packages and methods for producing delamination-resistant redistribution layers. This method involves constructing inner redistribution layers over a semiconductor die, ensuring durability and reliability in semiconductor applications.
Career Highlights
Throughout his career, Trung Duong has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Trung Duong has collaborated with several professionals in his field, including Michael B. Vincent and Zhiwei Gong. These collaborations have likely fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Trung Duong's work in semiconductor packaging has established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field.