Toshitsune Iijima

Title: The Innovative Contributions of Toshitsune Iijima

Introduction

Toshitsune Iijima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work has been instrumental in advancing manufacturing techniques for semiconductor devices.

Latest Patents

Iijima's latest patents include a method for manufacturing a semiconductor device and a semiconductor device itself. One embodiment of his manufacturing method involves covering multiple base plates, each containing semiconductor chips, with a sealing resin. This process ensures that the base plates are spaced apart from one another. Additionally, the method includes a step of cutting the sealing resin between the base plates. Another notable patent describes a method of dividing a semiconductor wafer utilizing a laser dicing technique. In this method, a semiconductor chip is formed by dividing a semiconductor wafer using a laser dicing technique. The chip features a laser dicing region on its side surface, with a dummy wiring layer formed along this region. A laser beam is then applied to the dummy wiring layer to effectively divide the semiconductor wafer.

Career Highlights

Toshitsune Iijima is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to explore innovative solutions in semiconductor manufacturing, contributing to the company's reputation for excellence in technology.

Collaborations

Iijima has collaborated with notable coworkers, including Ninao Sato and Hideo Taguchi. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Toshitsune Iijima's contributions to semiconductor technology through his patents and work at Toshiba highlight his role as a key innovator in the field. His advancements continue to influence the industry and pave the way for future innovations.