The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Sep. 27, 2002
Applicant:
Inventors:
Takeshi Kusakabe, Kanagawa-ken, JP;
Toshitsune Iijima, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/144 ; H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ; H01L 2/144 ; H01L 2/148 ;
Abstract
A semiconductor package of this invention comprises an electrode pad arranged on a semiconductor chip, a bonding wire, an end of which is coupled to the electrode pad, and a connection pad arranged parallel to a direction of arrangement of the bonding wire, to which another end of the bonding wire is coupled, and a pitch of the connection pad is wider than that of the electrode pad.
Kusakabe, Takeshi. (2004). Wiring pattern of semiconductor device (U.S. Patent No. 6713869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6713869
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile