The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Mar. 03, 2011
Applicant:
Toshitsune Iijima, Tokyo, JP;
Inventor:
Toshitsune Iijima, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a semiconductor device according to one embodiment of the present invention includes a step of covering a plurality of base plates in which respective semiconductor chips are mounted, by means of a sealing resin such that a plurality of base plates are spaced apart from each other, and a step of cutting the sealing resin between a plurality of base plates.