Chino, Japan

Toshimitsu Hirai

This inventor holds 77 USPTO granted patents and 21 published patent applications and 12 EPO patents, primarily in 3D Shaping Technology (CPC class B22F). Top assignees: Seiko Epson Corporation, Future Vision Inc.. Active years: 2005-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshimitsu Hirai. Retrieved from https://idiyas.com/inventor/toshimitsu-hirai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 77 

% Patents Active = 42.9

 

Average Co-Inventor Count = 2.1

ph-index = 9

Forward Citations = 240(Granted Patents)

Forward Citations (Not Self Cited) = 215(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Nagano, JP (2007 - 2009)
  • Chino, JP (2005 - 2014)
  • Yamanashi, JP (2015 - 2018)
  • Hokotu, JP (2020)
  • Hokuto, JP (2012 - 2024)

Company Filing History:


Years Active: 2005-2025

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Areas of Expertise:
3D Shaping Device
Electro-Optical Device
Film Pattern Formation
Molding Method
Conductive Thin Film
3D Structure Manufacturing
Recording Apparatus
Ink-Jet Printer
Virtual Image Technology
Shaping Slurry
Wiring Pattern
Thin Film Pattern
77 patents (USPTO):Explore Patents

Title: **Toshimitsu Hirai: Innovator in Three-Dimensional Shaping Technologies**

Introduction

Toshimitsu Hirai, based in Chino, Japan, is a prolific inventor known for his significant contributions to three-dimensional shaping technologies. With an impressive portfolio of 74 patents, Hirai has focused on creating innovative methods and devices that enhance the production of three-dimensional shaped articles.

Latest Patents

Among his latest innovations is a patented method for producing three-dimensional shaped articles. This method involves stacking layers to create a stacked body, which includes specific steps such as the formation of a constituent layer and a support layer, culminating in a sintering step. Notably, the support layer is designed to experience a larger volume decrement during sintering compared to the constituent layer, allowing for improved structural integrity during the manufacturing process. Another noteworthy invention is a three-dimensional shaping device equipped with an ejection head that utilizes a binder composed of water, a water-soluble resin, and a wetting agent. This device features a unique circulation flow path, optimizing the use of materials in the production process.

Career Highlights

Hirai has had a distinguished career, contributing his expertise to renowned companies like Seiko Epson Corporation and Future Vision Inc. His work in these organizations has propelled him to the forefront of innovation in the field of three-dimensional shaping.

Collaborations

Throughout his career, Hirai has collaborated with notable coworkers, including Eiji Okamoto and Katsuyuki Moriya. These partnerships have not only enriched his projects but have also fostered a dynamic exchange of ideas, leading to breakthrough innovations.

Conclusion

Toshimitsu Hirai's dedication to advancing three-dimensional shaping methods and devices marks him as a pivotal figure in the field of innovation. His extensive patent portfolio illustrates his commitment to developing technologies that push the boundaries of what's possible in manufacturing. As industries continue to evolve, Hirai's contributions will undoubtedly play a critical role in shaping the future of production technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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