The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Dec. 05, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masaya Ishida, Hara-mura, JP;

Eiji Okamoto, Matsumoto, JP;

Hiroshi Wada, Azumino, JP;

Toshimitsu Hirai, Hokuto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/16 (2021.01); B22F 10/43 (2021.01); B33Y 10/00 (2015.01); B22F 10/60 (2021.01); B29C 64/112 (2017.01); B29C 64/165 (2017.01); B29C 64/40 (2017.01); B33Y 80/00 (2015.01); B22F 3/10 (2006.01); B22F 12/30 (2021.01); B22F 12/55 (2021.01); B22F 10/20 (2021.01); B33Y 50/02 (2015.01); B23K 26/342 (2014.01); B23K 26/70 (2014.01); B28B 1/00 (2006.01); B33Y 30/00 (2015.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B22F 3/1017 (2013.01); B22F 3/1021 (2013.01); B22F 10/16 (2021.01); B22F 10/20 (2021.01); B22F 10/43 (2021.01); B22F 12/30 (2021.01); B22F 12/55 (2021.01); B23K 26/342 (2015.10); B23K 26/70 (2015.10); B28B 1/001 (2013.01); B29C 64/165 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B22F 10/60 (2021.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29K 2105/251 (2013.01); B33Y 30/00 (2014.12);
Abstract

A three-dimensional shaped article production method for producing a three-dimensional shaped article by stacking layers to form a stacked body includes a first layer formation step of forming a first layer on a support by supplying a first composition containing first particles and a binder, a second layer formation step of forming a second layer composed of one layer or a plurality of layers on the first layer by supplying a second composition containing second particles and a binder, and a separation step of separating the second layer from the support through the first layer, wherein after the separation step, a sintering step of sintering the second layer is performed.


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