The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2021

Filed:

Nov. 08, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Eiji Okamoto, Matsumoto, JP;

Masaya Ishida, Hara-mura, JP;

Daiki Tokushima, Azumino, JP;

Toshimitsu Hirai, Hokuto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B29C 64/124 (2017.01); B22F 3/00 (2006.01); B33Y 40/00 (2020.01); B29C 64/112 (2017.01); B29C 64/40 (2017.01); B29C 64/165 (2017.01);
U.S. Cl.
CPC ...
B33Y 10/00 (2014.12); B22F 3/008 (2013.01); B29C 64/112 (2017.08); B29C 64/124 (2017.08); B29C 64/40 (2017.08); B33Y 40/00 (2014.12); B29C 64/165 (2017.08);
Abstract

A method of manufacturing a three-dimensionally formed object in which the three-dimensionally formed object is manufactured by laminating layers to forma laminate, includes: forming a constituent layer corresponding to a constituent region of the three-dimensionally formed object; forming a support layer which is in contact with the constituent layer and supports the constituent layer by ejecting a flowable composition including a resin from an ejecting portion in the form of liquid drops; solidifying the support layer; and heating the laminate which is formed in the formation of the constituent layer, the formation of the support layer, and the solidification of the support layer.


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