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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11185922 B1

PDFFull Text
Date of Patent:
Nov. 30, 2021

Filed:

Oct. 26, 2016

Manufacturing method for three-dimensional structure, manufacturing apparatus for three-dimensional structure, and control program for manufacturing apparatus

Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masaya Ishida, Hara, JP;

Toshimitsu Hirai, Hokuto, JP;

Eiji Okamoto, Matsumoto, JP;

Assignee:

Seiko Epson Corporation, Tokyo, JP;

Attorney:

Workman Nydegger

Primary Examiner:

Nicholas A Wang

Int. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 7/00 (2006.01); B22F 7/02 (2006.01); B22F 7/06 (2006.01); B28B 1/00 (2006.01); B29C 64/153 (2017.01); B33Y 10/00 (2015.01); C04B 35/622 (2006.01); C22C 29/16 (2006.01); B22F 10/30 (2021.01); B29C 64/209 (2017.01); B29C 64/336 (2017.01); B29K 105/00 (2006.01); B29L 9/00 (2006.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); C22C 26/00 (2006.01); C22C 29/06 (2006.01); C22C 29/12 (2006.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 7/008 (2013.01); B22F 7/02 (2013.01); B22F 7/06 (2013.01); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); C04B 35/62222 (2013.01); B22F 10/30 (2021.01); B22F 2301/35 (2013.01); B22F 2302/253 (2013.01); B22F 2302/406 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B29C 64/209 (2017.08); B29C 64/336 (2017.08); B29K 2105/251 (2013.01); B29L 2009/00 (2013.01); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); C04B 2235/6026 (2013.01); C04B 2235/665 (2013.01); C22C 26/00 (2013.01); C22C 29/06 (2013.01); C22C 29/12 (2013.01); C22C 29/16 (2013.01); Y02P 10/25 (2015.11);
Abstract

A manufacturing method for a three-dimensional structure includes forming unit layers using at least one of a first flowable composition including first powder and a second flowable composition including second powder and solidifying at least one of the first flowable composition including the first powder and the second flowable composition including the second powder in the unit layers. In the forming the unit layers, both of the first flowable composition and the second flowable composition are caused to be present in plane directions crossing a thickness direction of the unit layers.

Find Patent Forward Citations

Ishida, Masaya. (2021). Manufacturing method for three-dimensional structure, manufacturing apparatus for three-dimensional structure, and control program for manufacturing apparatus (U.S. Patent No. 11185922). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11185922

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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