Toshimi Kohmura

Title: The Innovations of Toshimi Kohmura

Introduction

Toshimi Kohmura is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of technology, particularly in the area of device embedding techniques. With a total of 4 patents to his name, Kohmura's work has garnered attention for its innovative approaches to reducing interconnect lengths between devices.

Latest Patents

One of Kohmura's latest patents involves a technique for embedding a device in a substrate cavity. This invention focuses on forming a cavity in a substrate that has a specific depth. A first device, which has a device surface and a thickness, is placed into this cavity. The thickness of the device matches the depth of the cavity, ensuring that the device surface is approximately planar with the substrate surface. This design allows for the first device to be attached to a second device via bumps on the second device, effectively reducing interconnect lengths.

Career Highlights

Kohmura is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key player in advancing device integration techniques.

Collaborations

Throughout his career, Kohmura has collaborated with several talented individuals, including Munehiro Toyama and Charan K Gurumurthy. These collaborations have contributed to the success of his projects and the advancement of technology in his field.

Conclusion

Toshimi Kohmura's contributions to technology through his patents and work at Intel Corporation highlight his innovative spirit and dedication to improving device integration techniques. His inventions continue to influence the industry and pave the way for future advancements.