The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
Mar. 31, 2006
Applicants:
Munehiro Toyama, Tsukubashi, JP;
Charan Gurumurthy, Higley, AZ (US);
Toshimi Kohmura, Tsuchiura, JP;
Inventors:
Munehiro Toyama, Tsukubashi, JP;
Charan Gurumurthy, Higley, AZ (US);
Toshimi Kohmura, Tsuchiura, JP;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness matches the depth such that the device surface is approximately planar with the substrate surface. The first device is attached to a second device via bumps on the second device.