The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2002
Filed:
Jun. 29, 2000
Aaron Dean Hale, Chandler, AZ (US);
Michael Walk, Mesa, AZ (US);
David G. Figueroa, Mesa, AZ (US);
Joan K. Vrtis, Phoenix, AZ (US);
Toshimi Kohmura, Ibaraki-ken, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic package ( , FIG. ) includes one or more capacitors ( ) embedded within one or more layers ( ) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. ) or ceramic capacitors. During the package build-up process, the capacitors are mounted ( , FIG. ) to a package layer, and a non-conductive layer is applied ( ) over the capacitors. When the build-up process is completed, the capacitor's terminals ( , FIG. ) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package ( , FIG. ), an interposer ( ), and/or a printed circuit board ( ).