Toshihisa Kumakura

Title: The Innovations of Toshihisa Kumakura

Introduction

Toshihisa Kumakura is a notable inventor based in Shimodate, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced adhesive and insulating materials. With a total of 5 patents to his name, Kumakura's work has had a substantial impact on the electronics industry.

Latest Patents

Kumakura's latest patents include an "Adhesion Assisting Agent Fitted Metal Foil" and a "Printed Wiring Board Using Thereof." The adhesion assisting agent fitted metal foil comprises an adhesion assisting agent layer with a thickness of 0.1 to 10 µm on a metal surface with a ten-point average roughness Rz of 2.0 µm or less. This layer is formed from a composition that includes an epoxy resin selected from novolak and aralkyl epoxy resins, along with an epoxy resin curing agent. His other patent focuses on a method for preparing an insulating resin composition, which includes a novolak epoxy resin with a biphenyl structure, carboxylic acid-modified acrylonitrile butadiene rubber particles, and various other components. This innovation is crucial for producing multilayer wiring boards.

Career Highlights

Kumakura is currently employed at Hitachi Chemical Company, Ltd., where he continues to push the boundaries of material science. His work has been instrumental in developing products that enhance the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Shin Takanezawa and Koji Morita. Their collaborative efforts have contributed to the advancement of technologies in their field.

Conclusion

Toshihisa Kumakura's innovative work in adhesive and insulating materials has made a significant impact on the electronics industry. His patents reflect a commitment to advancing technology and improving product performance.