The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Sep. 24, 1999
Toshihisa Kumakura, Shimodate, JP;
Takeshi Horiuchi, Tochigi, JP;
Kazuyuki Magome, Shimodate, JP;
Norifumi Shiraishi, Noda, JP;
Toshihisa Kumakura, Shimodate, JP;
Takeshi Horiuchi, Tochigi, JP;
Kazuyuki Magome, Shimodate, JP;
Norifumi Shiraishi, Noda, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 μm, using a copper foil pattern with a width of 4 mm and making a distance between electrodes 0.4 mm, then the adhesive layer dissolves out for the first time when 5 drops or more of an electrolyte are dropped thereon, an adhesive-coated metal foil, a metal-clad laminate, a wiring board, a multi-layer board and a multi-layer wiring board using the same.