The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2010
Filed:
Nov. 10, 2005
Nobuyuki Ogawa, Tsukuba, JP;
Hitoshi Onozeki, Chikusei, JP;
Takahiro Tanabe, Oyama, JP;
Kenji Takai, Saitama, JP;
Norio Moriike, Chikusei, JP;
Shin Takanezawa, Chikusei, JP;
Takako Ejiri, Chikusei, JP;
Toshihisa Kumakura, Chikusei, JP;
Nobuyuki Ogawa, Tsukuba, JP;
Hitoshi Onozeki, Chikusei, JP;
Takahiro Tanabe, Oyama, JP;
Kenji Takai, Saitama, JP;
Norio Moriike, Chikusei, JP;
Shin Takanezawa, Chikusei, JP;
Takako Ejiri, Chikusei, JP;
Toshihisa Kumakura, Chikusei, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.