Hitachi Chemical Company, Ltd.

Toshihisa Kumakura

Shin Takanezawa

Koji Morita

Hiroyuki Fukai

Takako Watanabe

Hiroaki Fujita

Ken Nanaumi

Nobuyuki Ogawa

Kenji Takai

Norio Moriike

Takeshi Horiuchi

Ryoichi Ikezawa

Takahiro Tanabe

Takako Ejiri

Hitoshi Onozeki

Norifumi Shiraishi

Hideki Eriguchi

Kazuyuki Magome

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Disclosed are an adhesive composition for a metal foil which comprises a material wherein a tracking resistance test is carried out according to the IEC method by making a thickness of an adhesive layer 30 to 40 &#x3bc;m, using a copper foil pattern with a width of 4 mm and making a distance between electrodes 0.4 mm, then the adhesive layer dissolves out for the first time when 5 drops or more of an electrolyte are dropped thereon, an adhesive-coated metal foil, a metal-clad laminate, a wiring board, a multi-layer board and a multi-layer wiring board using the same.

Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same

An adhesive composition for metal-clad laminates which comprises:

Adhesive composition for metal-clad laminates

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Shimodate, Japan

Toshihisa Kumakura