Company Filing History:
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Years Active: 2018-2025
Title: Innovations of Tomoya Tsukui in Semiconductor Technology
Introduction
Tomoya Tsukui is a notable inventor based in Shibukawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work primarily focuses on developing innovative adhesive sheets for backgrinding semiconductor wafers, which are crucial in the manufacturing process of electronic devices.
Latest Patents
Among his latest patents, Tsukui has developed an adhesive sheet for backgrinding that enables sufficient backgrinding while protecting protrusions on semiconductor wafers. This invention features a non-adhesive cushion layer and an adhesive layer, which is characterized by specific viscosity and hardness properties. The adhesive sheet is designed to ensure that the protrusions are adequately protected during the backgrinding process. Another patent involves a back grinding adhesive sheet that also protects protrusions while allowing for effective back grinding. This sheet includes an opening smaller than the wafer's diameter, ensuring that the protrusions remain shielded during the adhesion process.
Career Highlights
Throughout his career, Tomoya Tsukui has worked with prominent companies in the semiconductor industry, including Denka Company Limited and Disco Corporation. His experience in these organizations has allowed him to refine his expertise and contribute to advancements in semiconductor manufacturing.
Collaborations
Tsukui has collaborated with notable professionals in his field, including Gosuke Nakajima and Karl Heinz Priewasser. These collaborations have further enhanced his innovative capabilities and have led to the development of cutting-edge technologies in semiconductor processing.
Conclusion
Tomoya Tsukui's contributions to semiconductor technology through his innovative patents and collaborations highlight his significant role in advancing the industry. His work continues to influence the manufacturing processes of electronic devices, ensuring efficiency and protection of critical components.