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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9963622 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Jun. 10, 2014

Heat-resistant adhesive sheet for semiconductor testing

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Gosuke Nakajima, Shibukawa, JP;

Tomoya Tsukui, Shibukawa, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Sanza McClendon

Int. Cl.
CPC ...
C08F 220/20 (2006.01); H01L 21/68 (2006.01); C09J 133/08 (2006.01); C08F 2/48 (2006.01); C09J 4/06 (2006.01); C09J 133/06 (2006.01); C09J 175/04 (2006.01); C09J 183/10 (2006.01); H01L 21/683 (2006.01); C08G 18/62 (2006.01); C08G 18/67 (2006.01); C08G 18/73 (2006.01); C08G 18/79 (2006.01); C08G 18/80 (2006.01); C09J 175/16 (2006.01); C09J 133/14 (2006.01); C08L 75/14 (2006.01); C08L 83/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); C08F 2/48 (2013.01); C08G 18/6229 (2013.01); C08G 18/673 (2013.01); C08G 18/73 (2013.01); C08G 18/792 (2013.01); C08G 18/8022 (2013.01); C08L 75/14 (2013.01); C08L 83/00 (2013.01); C09J 4/06 (2013.01); C09J 7/35 (2018.01); C09J 133/06 (2013.01); C09J 133/14 (2013.01); C09J 175/04 (2013.01); C09J 175/16 (2013.01); C09J 183/10 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0×10at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.

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