The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Feb. 21, 2020
Disco Corporation, Tokyo, JP;
Denka Company Limited, Tokyo, JP;
Karl Heinz Priewasser, Kirchheim b. Muenchen, JP;
Tomoya Tsukui, Tokyo, JP;
Tomoyuki Kanai, Tokyo, JP;
Takeshi Saito, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
DENKA COMPANY LIMITED, Tokyo, JP;
Abstract
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2). (1) When the cushion layer is cut out using the dumbbell from JISZ1702 and is stretched 25% at a gauge length of 40 mm and a tensile speed of 300 mm/min, the tensile stress is 2-30N/10 mm. (2) The cushion layer is formed from a thermoplastic resin that has a melt flow rate (JISK7210, 125° C./10.0 kg load) of 0.2-30 g/10 min, and a melting point of 60-110° C.