The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jul. 06, 2015
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Tomoya Tsukui, Shibukawa, JP;

Gosuke Nakajima, Shibukawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); C09J 4/06 (2006.01); C09J 7/02 (2006.01); C09J 133/10 (2006.01); C09J 5/06 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 4/06 (2013.01); C09J 5/06 (2013.01); C09J 7/0203 (2013.01); C09J 133/10 (2013.01); H01L 21/78 (2013.01); C09J 2203/326 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68336 (2013.01);
Abstract

An adhesive sheet is provided that is capable of inhibiting scraping up of an adhesive in the dicing step, does not cause chip detachment during dicing processing, facilitates picking up, and does not readily develop adhesive transfer. According to the present invention, an adhesive sheet is provided that comprises a substrate film and an adhesive layer laminated on the film, wherein the adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, from 5 to 250 parts by mass of a photopolymerizable compound, from 20 to 160 parts by mass of a softener, from 0.1 to 30 parts by mass of a curing agent, and from 0.1 to 20 parts by mass of a photopolymerization initiator, and the photopolymerizable compound has a weight average molecular weight from 40,000 to 220,000.


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