Tomomi Komura

Title: Tomomi Komura: Innovator in Wafer Grinding Technology

Introduction

Tomomi Komura is a notable inventor based in Tochigi, Japan. She has made significant contributions to the field of wafer grinding technology, holding a total of 4 patents. Her innovative work focuses on improving the efficiency and quality of wafer processing.

Latest Patents

One of her latest patents is titled "Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder." This patent discloses systems and methods for modulating hydrostatic pressure in a double side wafer grinder equipped with a pair of grinding wheels. The systems utilize a processor to measure the electrical current drawn by the grinding wheels. Additionally, pattern detection software predicts the grinding stage based on the measured electrical current. The hydrostatic pressure is adjusted by flow control valves at each stage to enhance the clamping pressure applied to the wafer, ultimately improving the nanotopology of the processed wafer.

Another significant patent is "Methods and systems for adjusting operation of a wafer grinder using feedback from warp data." This invention involves processing a wafer using a double side grinder with a pair of grinding wheels. Warp data is obtained through a warp measurement device that measures the warp of a wafer during grinding. The received warp data is used to predict the nanotopography of the wafer, and a grinding parameter is determined based on this prediction. The operation of the double side grinder is then adjusted according to the determined grinding parameter.

Career Highlights

Tomomi Komura is currently employed at MEMC Electronic Materials, Inc., where she continues to innovate in the field of semiconductor manufacturing. Her work has been instrumental in advancing the technology used in wafer processing.

Collaborations

Some of her notable coworkers include Sumeet S Bhagavat and Roland R Vandamme, who contribute to the collaborative environment that fosters innovation at MEMC Electronic Materials, Inc.

Conclusion

Tomomi Komura's contributions to wafer grinding technology exemplify her dedication to innovation and excellence in her field. Her patents reflect a commitment to improving manufacturing processes, which is vital for the advancement of semiconductor technology.