The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Mar. 16, 2011
Applicants:

Sumeet S. Bhagavat, St. Peters, MO (US);

Roland R. Vandamme, Wentzville, MO (US);

Tomomi Komura, Tochigi, JP;

Inventors:

Sumeet S. Bhagavat, St. Peters, MO (US);

Roland R. Vandamme, Wentzville, MO (US);

Tomomi Komura, Tochigi, JP;

Assignee:

MEMC Electronic Materials, Inc., St. Peters, MO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); H01L 21/00 (2006.01); B24B 9/14 (2006.01); H01L 21/78 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 9/148 (2013.01); H01L 21/78 (2013.01); B24B 37/042 (2013.01);
Abstract

Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.


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