The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2012
Filed:
Sep. 27, 2010
Sumeet S. Bhagavat, Creve Coeur, MO (US);
Roland R. Vandamme, Wentzville, MO (US);
Tomomi Komura, Utsunomiya, JP;
Tomhiko Kaneko, Ageo, JP;
Takuto Kazama, Utsunomiya, JP;
Sumeet S. Bhagavat, Creve Coeur, MO (US);
Roland R. Vandamme, Wentzville, MO (US);
Tomomi Komura, Utsunomiya, JP;
Tomhiko Kaneko, Ageo, JP;
Takuto Kazama, Utsunomiya, JP;
MEMC Electronic Materials, Inc., St. Peters, MO (US);
Abstract
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.