Location History:
- Tochigi Prefecture, JP (2011 - 2012)
- Utsunomiya, JP (2011 - 2012)
Company Filing History:
Years Active: 2011-2012
Title: Takuto Kazama: Innovator in Semiconductor Wafer Grinding Technologies
Introduction
Takuto Kazama is a prominent inventor based in Tochigi Prefecture, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer grinding technologies. With a total of 4 patents to his name, Kazama's work focuses on improving the efficiency and quality of semiconductor wafers.
Latest Patents
Kazama's latest patents include innovative methods for grinding semiconductor wafers that enhance nanotopology. One of his notable inventions is a method for holding a workpiece with a hydrostatic pad. This pad features hydrostatic pockets that receive fluid, creating a barrier between the pad and the workpiece while applying necessary pressure during grinding. This design allows the wafer to rotate relative to the pads, reducing hydrostatic bending moments that can degrade the wafer's surface. Another significant patent involves methods and systems for adjusting the operation of a wafer grinder using feedback from warp data. This process utilizes a double side grinder and incorporates warp measurement devices to predict nanotopography and adjust grinding parameters accordingly.
Career Highlights
Kazama is currently employed at Memc Electronic Materials, Inc., where he continues to develop cutting-edge technologies in semiconductor processing. His work has been instrumental in advancing the capabilities of wafer grinding, ensuring higher quality and efficiency in semiconductor production.
Collaborations
Kazama collaborates with esteemed colleagues such as Roland R Vandamme and Sumeet S Bhagavat, contributing to a dynamic research environment that fosters innovation.
Conclusion
Takuto Kazama's contributions to semiconductor wafer grinding technologies exemplify his commitment to innovation in the field. His patents reflect a deep understanding of the challenges in semiconductor manufacturing and provide solutions that enhance the quality of the final products.