The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Oct. 06, 2010
Milind S. Bhagavat, Fremont, CA (US);
Puneet Gupta, Houston, TX (US);
Roland R. Vandamme, Wentzville, MO (US);
Takuto Kazama, Tochigi Prefecture, JP;
Noriyuki Tachi, Tokyo, JP;
Milind S. Bhagavat, Fremont, CA (US);
Puneet Gupta, Houston, TX (US);
Roland R. Vandamme, Wentzville, MO (US);
Takuto Kazama, Tochigi Prefecture, JP;
Noriyuki Tachi, Tokyo, JP;
MEMC Electronic Materials, Inc., St. Peters, MO (US);
Abstract
Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.