Tom Letson

Title: The Innovations of Tom Letson

Introduction

Tom Letson is an accomplished inventor based in Beaverton, Oregon. He has made significant contributions to the field of semiconductor technology, particularly in the area of silicon via etching. With a total of three patents to his name, Letson's work has had a notable impact on the industry.

Latest Patents

One of Letson's latest patents is focused on an etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stacks. This innovative method involves forming a silicon (Si) via in vertically stacked wafers, which includes a contact plug extending from selected metallic lines of a top wafer. The process comprises selectively etching through the silicon (Si) of the top wafer until stopped by the etch stop layer to form the Si via. Additionally, it involves depositing an oxide layer to insulate the sidewall of the Si via, forming a barrier layer on the oxide layer and the bottom of the Si via, and depositing a conduction metal into the Si via to provide electrical connection between active integrated circuit (IC) devices located on vertically stacked wafers and an external interconnect.

Career Highlights

Tom Letson is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in semiconductor technology. His work has been instrumental in advancing the capabilities of integrated circuits, making them more efficient and reliable.

Collaborations

Letson has collaborated with notable colleagues, including Sarah E. Kim and R. Scott List. Their combined expertise has contributed to the successful development of cutting-edge technologies in the semiconductor industry.

Conclusion

Tom Letson's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his role as a leading inventor. His work continues to influence the future of integrated circuits and semiconductor manufacturing.