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For the Inventor, By the Inventor

Weil im Schoenbuch, Germany

Tobias Werner

USPTO Granted Patents = 32 

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 44(Granted Patents)


Location History:

  • Schoenbuch, DE (2014)
  • Boeblingen, DE (2016 - 2017)
  • Weil im Schoenbuch, DE (2008 - 2022)

Company Filing History:

goldMedal32 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2008-2022

where 'Filed Patents' based on already Granted Patents

32 patents (USPTO):
1. 11328110 - Integrated circuit including logic circuitry (2022-05-10),
2. 11171142 - Integrated circuit with vertical structures on nodes of a grid (2021-11-09),
3. 11164879 - Microelectronic device with a memory element utilizing stacked vertical devices (2021-11-02),
4. 10833089 - Buried conductive layer supplying digital circuits (2020-11-10),
5. 10804266 - Microelectronic device utilizing stacked vertical devices (2020-10-13),
6. 10565340 - Field-effect transistor placement optimization for improved leaf cell routability (2020-02-18),
7. 10394994 - Field-effect transistor placement optimization for improved leaf cell routability (2019-08-27),
8. 9997218 - Dual mode operation having power saving and active modes in a stacked circuit topology with logic preservation (2018-06-12),
9. 9904754 - Layout of interconnect lines in integrated circuits (2018-02-27),
10. 9898571 - Layout of interconnect lines in integrated circuits (2018-02-20),
11. 9837142 - Automated stressing and testing of semiconductor memory cells (2017-12-05),
12. 9805823 - Automated stressing and testing of semiconductor memory cells (2017-10-31),
13. 9792967 - Managing semiconductor memory array leakage current (2017-10-17),
14. 9786339 - Dual mode operation having power saving and active modes in a stacked circuit topology with logic preservation (2017-10-10),
15. 9761289 - Managing semiconductor memory array leakage current (2017-09-12),

Title: Innovations by Tobias Werner: A Leader in Integrated Circuits

Introduction

Tobias Werner, located in Weil im Schönbuch, Germany, is a prolific inventor with an impressive portfolio of 32 patents. His work primarily focuses on advancements in integrated circuit technology, showcasing his commitment to innovation in the electrical engineering domain.

Latest Patents

Tobias's latest patents demonstrate his ingenuity in the field of integrated circuits. One notable invention is an "Integrated Circuit Including Logic Circuitry," which features a unique design comprising library blocks with symmetry mirror edges. This design enhances the integration of logic circuitry, offering improved performance for electronic devices.

Another significant patent is for an "Integrated Circuit with Vertical Structures on Nodes of a Grid." This invention incorporates a two-dimensional grid pattern of vertical transistor structures, optimizing the configuration of layers within the integrated circuit. These developments highlight Tobias’s expertise in creating efficient and effective circuit designs.

Career Highlights

Currently, Tobias is associated with International Business Machines Corporation (IBM), where he continues to innovate and contribute to cutting-edge technologies. His tenure at IBM has allowed him to work on various sophisticated projects that have impacted the industry significantly.

Collaborations

Throughout his career, Tobias has collaborated with esteemed colleagues, including Silke Penth and Yuen H. Chan. These partnerships underscore the collaborative spirit of the research community and contribute to the successful development of new technologies and inventions.

Conclusion

Tobias Werner is an exemplary figure in the realm of integrated circuit innovation. With 32 patents to his name, his contributions are paving the way for future technological advancements. His work at IBM and collaborations with talented coworkers further enhance his impact on the industry, inspiring future generations of inventors and engineers.

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