Company Filing History:
Years Active: 2013-2018
Title: **Inventor Tobias Hackl: Innovating EUV Lithography Technologies**
Introduction
Tobias Hackl, an accomplished inventor based in Langenau, Germany, has made significant contributions to the field of extreme ultraviolet (EUV) lithography. With two patents to his name, his work focuses on enhancing the technology that underpins modern semiconductor manufacturing.
Latest Patents
Tobias Hackl’s latest innovations include two notable patents that advance the functionality of mirrors used in EUV lithography. The first patent addresses **Surface Correction of Mirrors with Decoupling Coating**. This invention encompasses a mirror design that includes a substrate and a reflective coating. The reflective coating is structured in two groups of layers that effectively reflect radiation between 5 nm and 30 nm wavelengths. A crucial feature is the inclusion of a decoupling coating that optically separates the two groups of layers, ultimately enhancing the mirror's performance by correctively varying the layer thickness.
The second patent outlines an **Optical System for EUV Lithography with a Charged-Particle Source**. This system is designed to mitigate the issue of reflective optical elements becoming electrically charged when exposed to EUV radiation. Hackl’s design incorporates a highly reflective substrate that emits secondary electrons upon irradiation with EUV light. A specially configured flood gun is utilized to apply electrons to the reflective optical element, helping maintain its efficacy and performance.
Career Highlights
Tobias Hackl is currently employed at Carl Zeiss SMT GmbH, a prominent company known for its cutting-edge optical technologies. His work at the company allows him to push the boundaries of what is possible in EUV lithography, contributing to advancements that are critical for the semiconductor industry.
Collaborations
Throughout his career, Hackl has collaborated with notable colleagues, including Oliver Dier and Franz-Josef Stickel. Their joint efforts in research and development further enhance the innovations produced at Carl Zeiss SMT GmbH.
Conclusion
Through his inventive spirit and technical expertise, Tobias Hackl has emerged as a key player in the realm of EUV lithography. His patents not only reflect his innovative thinking but also have far-reaching implications for the future of semiconductor manufacturing technology. As his career progresses, it is expected that Hackl will continue to contribute groundbreaking solutions to the industry.