Ting-Feng Su

Title: Innovations by Ting-Feng Su

Introduction

Ting-Feng Su is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing semiconductor device packaging and chip structures, which are crucial for modern electronic devices.

Latest Patents

One of his latest patents is a semiconductor device package with a stress relax pattern. This innovative package includes a die, a pattern of dielectric material formed on the active surface of the die, and a plurality of metal contacts that are electrically connected to the die. The design also features a mold compound formed around the pattern, the die, and the metal contacts, along with a redistribution layer that is electrically connected to the metal contacts. The dielectric material used in this invention has a Young's modulus lower than that of the mold compound, as well as a coefficient of thermal expansion that is also lower.

Another significant patent by Ting-Feng Su is a chip structure having a redistribution layer. This chip structure includes a chip with a plurality of pads and a redistribution layer that consists of a dielectric layer and a plurality of conductive traces. The dielectric layer is placed on the chip and has contact windows located above the pads. The conductive traces are positioned on the dielectric layer and are electrically coupled to the pads through these contact windows. Notably, at least one of the conductive traces features a body with at least one protrusion that is coupled to an area of the body other than where the contact windows are located.

Career Highlights

Ting-Feng Su is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His work at Powertech has allowed him to develop innovative solutions that enhance the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Ting-Feng Su has collaborated with talented individuals such as Chia-Jen Chou and Chien-Ming Chen. These collaborations have contributed to the advancement of technology in the semiconductor industry.

Conclusion

Ting-Feng Su's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of electronic devices.