Milton, VT, United States of America

Timothy W Budell

USPTO Granted Patents = 20 

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 79(Granted Patents)


Location History:

  • Colchester, VT (US) (2004)
  • Essex Jct., VT (US) (2012)
  • Westford, VT (US) (2011 - 2013)
  • Milton, VT (US) (2004 - 2016)

Company Filing History:


Years Active: 2004-2016

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):

Title: Innovator Spotlight: Timothy W Budell - Pioneering EMI Shielding Structures

Introduction:

Timothy W Budell, a prolific inventor hailing from Milton, VT, has made significant strides in the field of electronic packaging by developing cutting-edge EMI shielding structures. With an impressive portfolio of 20 patents, Budell continues to push the boundaries of innovation in the tech industry.

Latest Patents:

One of Budell's latest patents involves organic module EMI shielding structures and methods. This innovative apparatus provides shielding against electromagnetic interference (EMI) by incorporating advanced features such as a lid covering the integrated circuit chip, a fill material with EMI absorbing properties, and a side skirt for enhanced protection.

Career Highlights:

Throughout his career, Budell has worked with renowned companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc. His expertise and dedication to innovation have played a crucial role in the development of next-generation electronic packaging solutions.

Collaborations:

Budell's collaborative efforts with industry experts like David Brian Stone and Patrick H Buffet have helped in shaping the future of EMI shielding technologies. Together, they have leveraged their skills and knowledge to create groundbreaking solutions for addressing EMI challenges in electronic devices.

Conclusion:

Timothy W Budell's contributions to the field of electronic packaging and EMI shielding have had a profound impact on the industry. His commitment to innovation and his ability to collaborate with top-tier professionals underscore his position as a leading inventor in the tech sector. As Budell continues to drive advancements in this field, we can expect to see more groundbreaking inventions that will shape the future of electronic devices.

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