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For the Inventor, By the Inventor

Eagle, ID, United States of America

Timothy L Jackson

USPTO Granted Patents = 20

Average Co-Inventor Count = 1.6

ph-index = 11

Forward Citations = 1,747(Granted Patents)


Location History:

  • Boise, ID (US) (1991 - 1995)
  • Stone Mountain, GA (US) (2001)
  • Eagle, ID (US) (2001 - 2010)

Company Filing History:

goldMedal19 out of 37,950 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 832,812 
Other
 patents

Years Active: 1991-2010

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20 patents (USPTO):Explore Patents
1. 7811903 - Thin flip-chip method (2010-10-12),
2. 7755204 - Stacked die module including multiple adhesives that cure at different temperatures (2010-07-13),
3. 7355273 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods (2008-04-08),
4. 7291543 - Thin flip-chip method (2007-11-06),
5. 7217596 - Stacked die module and techniques for forming a stacked die module (2007-05-15),
6. 7186576 - Stacked die module and techniques for forming a stacked die module (2007-03-06),
7. 7029931 - Stacked die module and techniques for forming a stacked die module (2006-04-18),
8. 6962867 - Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof (2005-11-08),
9. 6905946 - Thin flip-chip method (2005-06-14),
10. 6800930 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies (2004-10-05),
11. 6682955 - Stacked die module and techniques for forming a stacked die module (2004-01-27),
12. 6664131 - Method of making ball grid array package with deflectable interconnect (2003-12-16),
13. 6630738 - Deflectable interconnect (2003-10-07),
14. 6506681 - Thin flip—chip method (2003-01-14),
15. 6503777 - Deflectable interconnect (2003-01-07),

Title: Innovator Spotlight: Timothy L Jackson - Pioneering Technological Advancements in Semiconductor Industry

Introduction: Timothy L Jackson, a visionary inventor hailing from Eagle, ID, has made significant strides in the semiconductor industry with his groundbreaking patents and innovative techniques. With a total of 19 patents to his name, Timothy is a trailblazer in the field of semiconductor technology.

Latest Patents:

1. Thin flip-chip method: Timothy's patent covers methods for thinning a bumped semiconductor wafer, allowing for the production of flip-chips with incredibly thin profiles. By introducing a mold compound between conductive bumps on the wafer's active face, the integrity of the wafer structure is preserved throughout various processes, ensuring optimal performance in flip-chip applications.

2. Stacked die module including multiple adhesives that cure at different temperatures: This patent showcases Timothy's expertise in forming die stacks without the need for coupling to a substrate. By using a specialized stacking tip and adhesive coatings, die stacks can be created and tested functionally and environmentally before final attachment to a substrate, revolutionizing the traditional approach to die stacking.

Career Highlights: Timothy L Jackson is an integral part of Micron Technology Incorporated, a leading company in the semiconductor industry. With his innovative contributions and patent portfolio, he has helped propel Micron Technology to the forefront of technological advancements in semiconductor manufacturing.

Collaborations: Timothy has collaborated with esteemed colleagues at Micron Technology, including Chad A Cobbley and Ford B Grigg. Together, they have worked on pushing the boundaries of semiconductor technology and creating cutting-edge solutions for industry challenges.

Conclusion: Timothy L Jackson's relentless pursuit of innovation and technological excellence has established him as a key figure in the semiconductor industry. His patents and contributions continue to shape the future of semiconductor manufacturing, setting new standards for efficiency and performance.

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