Timothy L Jackson

This inventor holds 20 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Other. Active years: 1991-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy L Jackson. Retrieved from https://idiyas.com/inventor/timothy-l-jackson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 11

Forward Citations = 1,752(Granted Patents)

Location History:

Boise, ID (US) (1991 - 1995)
Stone Mountain, GA (US) (2001)
Eagle, ID (US) (2001 - 2010)

Company Filing History:

19 out of 39,222

Micron Technology Incorporated

patents

1 out of 834,513

Other

patents

Years Active: 1991-2010

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Areas of Expertise:

Thin Flip-Chip Method

Stacked Die Module

Semiconductor Dice

Through-Silicon Vias

Back Side Redistribution Layer

Ball Grid Array Package

Deflectable Interconnect

Tracking Sensor Fixture

Reciprocating Staging Fixture

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7811903 - Thin flip-chip method (2010-10-12),

2. 7755204 - Stacked die module including multiple adhesives that cure at different temperatures (2010-07-13),

3. 7355273 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods (2008-04-08),

4. 7291543 - Thin flip-chip method (2007-11-06),

5. 7217596 - Stacked die module and techniques for forming a stacked die module (2007-05-15),

6. 7186576 - Stacked die module and techniques for forming a stacked die module (2007-03-06),

7. 7029931 - Stacked die module and techniques for forming a stacked die module (2006-04-18),

8. 6962867 - Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof (2005-11-08),

9. 6905946 - Thin flip-chip method (2005-06-14),

10. 6800930 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies (2004-10-05),

11. 6682955 - Stacked die module and techniques for forming a stacked die module (2004-01-27),

12. 6664131 - Method of making ball grid array package with deflectable interconnect (2003-12-16),

13. 6630738 - Deflectable interconnect (2003-10-07),

14. 6506681 - Thin flip—chip method (2003-01-14),

15. 6503777 - Deflectable interconnect (2003-01-07),

Title: Innovator Spotlight: Timothy L Jackson - Pioneering Technological Advancements in Semiconductor Industry

Introduction: Timothy L Jackson, a visionary inventor hailing from Eagle, ID, has made significant strides in the semiconductor industry with his groundbreaking patents and innovative techniques. With a total of 19 patents to his name, Timothy is a trailblazer in the field of semiconductor technology.

Latest Patents:

1. Thin flip-chip method: Timothy's patent covers methods for thinning a bumped semiconductor wafer, allowing for the production of flip-chips with incredibly thin profiles. By introducing a mold compound between conductive bumps on the wafer's active face, the integrity of the wafer structure is preserved throughout various processes, ensuring optimal performance in flip-chip applications.

2. Stacked die module including multiple adhesives that cure at different temperatures: This patent showcases Timothy's expertise in forming die stacks without the need for coupling to a substrate. By using a specialized stacking tip and adhesive coatings, die stacks can be created and tested functionally and environmentally before final attachment to a substrate, revolutionizing the traditional approach to die stacking.

Career Highlights: Timothy L Jackson is an integral part of Micron Technology Incorporated, a leading company in the semiconductor industry. With his innovative contributions and patent portfolio, he has helped propel Micron Technology to the forefront of technological advancements in semiconductor manufacturing.

Collaborations: Timothy has collaborated with esteemed colleagues at Micron Technology, including Chad A Cobbley and Ford B Grigg. Together, they have worked on pushing the boundaries of semiconductor technology and creating cutting-edge solutions for industry challenges.

Conclusion: Timothy L Jackson's relentless pursuit of innovation and technological excellence has established him as a key figure in the semiconductor industry. His patents and contributions continue to shape the future of semiconductor manufacturing, setting new standards for efficiency and performance.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]