Growing community of inventors

Eagle, ID, United States of America

Timothy L Jackson

Average Co-Inventor Count = 1.57

ph-index = 11

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1,747

Timothy L JacksonChad A Cobbley (5 patents)Timothy L JacksonFord B Grigg (4 patents)Timothy L JacksonTim Murphy (3 patents)Timothy L JacksonArthur Gregory Powell (1 patent)Timothy L JacksonRonald M Gines (1 patent)Timothy L JacksonMelvin T Willis, Sr (1 patent)Timothy L JacksonMaurice L Monroe (1 patent)Timothy L JacksonBenjamin Scandrett (1 patent)Timothy L JacksonTimothy L Jackson (20 patents)Chad A CobbleyChad A Cobbley (123 patents)Ford B GriggFord B Grigg (60 patents)Tim MurphyTim Murphy (12 patents)Arthur Gregory PowellArthur Gregory Powell (7 patents)Ronald M GinesRonald M Gines (1 patent)Melvin T Willis, SrMelvin T Willis, Sr (1 patent)Maurice L MonroeMaurice L Monroe (1 patent)Benjamin ScandrettBenjamin Scandrett (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (19 from 37,950 patents)

2. Other (1 from 832,812 patents)


20 patents:

1. 7811903 - Thin flip-chip method

2. 7755204 - Stacked die module including multiple adhesives that cure at different temperatures

3. 7355273 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

4. 7291543 - Thin flip-chip method

5. 7217596 - Stacked die module and techniques for forming a stacked die module

6. 7186576 - Stacked die module and techniques for forming a stacked die module

7. 7029931 - Stacked die module and techniques for forming a stacked die module

8. 6962867 - Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof

9. 6905946 - Thin flip-chip method

10. 6800930 - Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies

11. 6682955 - Stacked die module and techniques for forming a stacked die module

12. 6664131 - Method of making ball grid array package with deflectable interconnect

13. 6630738 - Deflectable interconnect

14. 6506681 - Thin flip—chip method

15. 6503777 - Deflectable interconnect

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12/21/2025
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