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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7186576 B1

PDFFull Text
Date of Patent:
Mar. 06, 2007

Filed:

Nov. 04, 2005

Stacked die module and techniques for forming a stacked die module

Applicants:

Chad A. Cobbley, Boise, ID (US);

Timothy L. Jackson, Eagle, ID (US);

Inventors:

Chad A. Cobbley, Boise, ID (US);

Timothy L. Jackson, Eagle, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Fletcher Yoder

Primary Examiner:

Carl Whitehead, Jr

Assistant Examiner:

James Mitchell

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/76 (2006.01); H01L 29/10 (2006.01); H01L 23/02 (2006.01); G01N 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.

Find Patent Forward Citations

Cobbley, Chad. (2007). Stacked die module and techniques for forming a stacked die module (U.S. Patent No. 7186576). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7186576

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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