The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Nov. 04, 2005
Applicants:
Chad A. Cobbley, Boise, ID (US);
Timothy L. Jackson, Eagle, ID (US);
Inventors:
Chad A. Cobbley, Boise, ID (US);
Timothy L. Jackson, Eagle, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 21/76 (2006.01); H01L 29/10 (2006.01); H01L 23/02 (2006.01); G01N 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a die stack of at least two semiconductor die without attaching either of the at least two semiconductor die to a substrate. Further, present embodiments include testing the semiconductor die in the die stack after the die stack is formed and prior to attaching either of the at least two semiconductor die to the substrate.