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For the Inventor, By the Inventor

Boise, ID, United States of America

Timothy J Allen

USPTO Granted Patents = 24 

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 127(Granted Patents)


Company Filing History:

goldMedal24 out of 38,002 
 
Micron Technology Incorporated
 patents

Years Active: 1990-2006

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24 patents (USPTO):Explore Patents
1. 7112252 - Assembly method for semiconductor die and lead frame (2006-09-26),
2. 6737734 - Structure and method for securing bussing leads (2004-05-18),
3. 6699734 - Method and apparatus for coupling a semiconductor die to die terminals (2004-03-02),
4. 6635954 - Stress reduction feature for LOC lead frame (2003-10-21),
5. 6610162 - Methods for stress reduction feature for LOC lead frame (2003-08-26),
6. 6600215 - Method and apparatus for coupling a semiconductor die to die terminals (2003-07-29),
7. 6579746 - Method and apparatus for coupling a semiconductor die to die terminals (2003-06-17),
8. 6569727 - Method of making a single-deposition-layer-metal dynamic random access memory (2003-05-27),
9. 6545343 - Hybrid frame with lead-lock tape (2003-04-08),
10. 6396131 - Stress reduction feature for LOC lead frame (2002-05-28),
11. 6388314 - Single deposition layer metal dynamic random access memory (2002-05-14),
12. 6349034 - Removable heat sink bumpers on a quad flat package (2002-02-19),
13. 6277225 - Stress reduction feature for LOC lead frame (2001-08-21),
14. 6274928 - Single deposition layer metal dynamic random access memory (2001-08-14),
15. 6252772 - Removable heat sink bumpers on a quad flat package (2001-06-26),

Title: Innovations and Contributions of Timothy J. Allen in Semiconductor Technology

Introduction

Timothy J. Allen is an accomplished inventor based in Boise, ID, specializing in advancements in semiconductor technology. With a remarkable portfolio of 24 patents, he has made significant contributions to the field, particularly through his work at Micron Technology Incorporated.

Latest Patents

Among his latest innovations are two notable patents. The first, titled "Assembly method for semiconductor die and lead frame," describes a LOC die assembly that incorporates a die adhered dielectrically to the underside of a lead frame. This inventive assembly features stress relief slots in the lead elements, which accommodate filler particles during transfer molding. This design not only reduces point stresses on the die's active surface but also enhances the locking mechanism of the leads. The second patent, "Structure and method for securing bussing leads," introduces a hybrid lead frame that facilitates conventional lead-to-I/O wire bonding as well as power and ground bussing. The use of lead-lock tape in this design ensures stability during manufacturing by preventing movement of the bussing leads.

Career Highlights

Timothy J. Allen's career at Micron Technology Incorporated has been marked by a commitment to innovation in semiconductor designs. His technical expertise and creativity have positioned him as a key player in developing technologies that enhance the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Allen has collaborated with respected colleagues such as Larry Duane Kinsman and Jerry Michael Brooks. These partnerships have further propelled advancements in semiconductor technology and have fostered an environment of collaborative innovation within the industry.

Conclusion

Timothy J. Allen's contributions to semiconductor technology, underscored by his 24 patents and collaborative efforts, reflect his dedication to pushing the boundaries of innovation. His work at Micron Technology Incorporated continues to influence the field, paving the way for future advancements in semiconductor applications.

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