The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2003
Filed:
Aug. 17, 2001
Aaron Schoenfeld, Boise, ID (US);
Manny K. F. Ma, Boise, ID (US);
Larry D. Kinsman, Boise, ID (US);
J. Mike Brooks, Caldwell, ID (US);
Timothy J. Allen, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals. The first and second conductive members may each have an intermediate portion between the first and second end portions thereof that is narrower than the second end portions thereof, and the conductive members may be staggered by axially offsetting the second end portion of the second conductive member from the second end portion of the first conductive member.