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Tim J Corbett

This inventor holds 54 USPTO granted patents, primarily in Semiconductor Fabrication (CPC class 3247). Top assignees: Micron Technology Incorporated, Other. Active years: 1990-2015.

USPTO Granted Patents = 54

% Patents Active = 74.1

Average Co-Inventor Count = 1.9

ph-index = 19

Forward Citations = 1,392(Granted Patents)

Forward Citations (Not Self Cited) = 1,274(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

53 out of 39,149

Micron Technology Incorporated

patents

1 out of 834,411

Other

patents

Years Active: 1990-2015

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Areas of Expertise:

Semiconductor Components

Laser Marking Techniques

Wafer Carrier

Die Burn-In

Reliability Testing

Thinned Semiconductors

Electrical Contacts

Dopants

Matrix Materials

Burn-In Testing

Identifying Indicia

Fabrication Methods

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9039474 - Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods (2015-05-26),

2. 8728921 - Method for fabricating semiconductor components having lasered features containing dopants (2014-05-20),

3. 8530895 - Thinned semiconductor components having lasered features and method of fabrication (2013-09-10),

4. 8187983 - Methods for fabricating semiconductor components using thinning and back side laser processing (2012-05-29),

5. 7511520 - Universal wafer carrier for wafer level die burn-in (2009-03-31),

6. 7452732 - Comparing identifying indicia formed using laser marking techniques to an identifying indicia model (2008-11-18),

7. 7362113 - Universal wafer carrier for wafer level die burn-in (2008-04-22),

8. 7288953 - Method for testing using a universal wafer carrier for wafer level die burn-in (2007-10-30),

9. 7167014 - Method for testing using a universal wafer carrier for wafer level die burn-in (2007-01-23),

10. 7167012 - Universal wafer carrier for wafer level die burn-in (2007-01-23),

11. 7161373 - Method for testing using a universal wafer carrier for wafer level die burn-in (2007-01-09),

12. 7141997 - Method for testing using a universal wafer carrier for wafer level die burn-in (2006-11-28),

13. 7112986 - Method for testing using a universal wafer carrier for wafer level die burn-in (2006-09-26),

14. 7112985 - Method for testing using a universal wafer carrier for wafer level die burn-in (2006-09-26),

15. 6998860 - Method for burn-in testing semiconductor dice (2006-02-14),

Title: The Innovative Journey of Tim J Corbett

Introduction: Tim J Corbett, a talented inventor hailing from Boise, ID (US), has made significant contributions to the world of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Tim J Corbett's latest patents showcase his expertise in various fields, including technology, engineering, and design. His recent inventions have been recognized for their ingenuity and practicality.

Career Highlights: Throughout his illustrious career, Tim J Corbett has been at the forefront of groundbreaking inventions that have revolutionized industries. His passion for innovation has led to the development of cutting-edge solutions that address complex challenges.

Collaborations: Tim J Corbett has collaborated with leading companies, research institutions, and universities to bring his inventions to life. His ability to work with diverse teams and leverage collective expertise has been instrumental in the success of his projects.

Conclusion: Tim J Corbett's relentless pursuit of innovation and commitment to excellence have established him as a prominent figure in the world of inventors. His remarkable contributions continue to inspire future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.

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