Tigran Nshanian

Title: Tigran Nshanian: Innovator in Semiconductor Technology

Introduction

Tigran Nshanian is a prominent inventor based in Santa Clara, CA, known for his contributions to semiconductor technology. With a total of 5 patents, he has made significant advancements in the field, particularly in bonding techniques and defect reduction in III-nitride structures.

Latest Patents

One of Nshanian's latest patents focuses on "Bonding ultra-dense bump arrays using alignment bumps." This invention utilizes additional 'auxiliary' bumps to stabilize alignment and minimize slippage of dense arrays of interconnect bumps during the bonding process. The patent describes two types of auxiliary bumps: interdigitated bumps, which are more self-aligning, and nail bumps, where a harder bump drives into a softer bump to constrain lateral movement. Another notable patent addresses "Reducing or eliminating nanopipe defects in III-nitride structures." This invention involves a light-emitting layer and a nanopipe terminating layer that effectively manages defects within the III-nitride layer.

Career Highlights

Throughout his career, Tigran Nshanian has worked with notable companies such as Lumileds LLC and Koninklijke Philips Corporation N.V. His work has significantly impacted the development of advanced semiconductor technologies.

Collaborations

Nshanian has collaborated with talented individuals in the field, including Patrick Nolan Grillot and Isaac Wildeson. Their combined expertise has contributed to the success of various projects and innovations.

Conclusion

Tigran Nshanian's innovative work in semiconductor technology, particularly in bonding techniques and defect management, showcases his significant contributions to the industry. His patents reflect a commitment to advancing technology and improving manufacturing processes.