Lumileds LLC

Koninklijke Philips Corporation N.v.

Tectus Corporation

Tigran Nshanian

Isaac Wildeson

Patrick Nolan Grillot

Parijat Deb

Paul Scott Martin

Kwong-Hin Henry Choy

Arnold Daguio

Parijan Pramil Deb

Nachiket Raghunath Raravikar

Additional 'auxiliary' bumps are used to stabilize alignment and reduce slippage of dense arrays of interconnect bumps on opposing die during a bonding process. One example of auxiliary bumps are interdigitated bumps. Interdigitated bumps are more self-aligning and laterally stable because bumps do not meet head-to-head. Rather, the head of a bump on one die falls into the space between bumps on the other die. Another example of auxiliary bumps are nail bumps. In nail bumps, one bump is harder (the nail) and 'drives' into the opposing softer bump during bonding. This constrains the lateral movement of the two bumps relative to each other and reduces lateral slippage. In some embodiments, the auxiliary bumps and interconnect bumps are formed in the same process, and also bonded in the same process.

Bonding ultra-dense bump arrays using alignment bumps

Embodiments of the invention include a III-nitride light emitting layer disposed between an n-type region and a p-type region, a III-nitride layer including a nanopipe defect, and a nanopipe terminating layer disposed between the III-nitride light emitting layer and the III-nitride layer comprising a nanopipe defect. The nanopipe terminates in the nanopipe terminating layer.

Reducing or eliminating nanopipe defects in III-nitride structures

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Santa Clara, CA, United States of America

Tigran Nshanian