The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2023
Filed:
Jan. 29, 2021
Tectus Corporation, Saratoga, CA (US);
Nachiket Raghunath Raravikar, Saratoga, CA (US);
Arnold Daguio, Gilroy, CA (US);
Kwong-Hin Henry Choy, San Jose, CA (US);
Tigran Nshanian, Santa Clara, CA (US);
Paul Scott Martin, Palo Alto, CA (US);
Tectus Corporation, Saratoga, CA (US);
Abstract
Additional 'auxiliary' bumps are used to stabilize alignment and reduce slippage of dense arrays of interconnect bumps on opposing die during a bonding process. One example of auxiliary bumps are interdigitated bumps. Interdigitated bumps are more self-aligning and laterally stable because bumps do not meet head-to-head. Rather, the head of a bump on one die falls into the space between bumps on the other die. Another example of auxiliary bumps are nail bumps. In nail bumps, one bump is harder (the nail) and 'drives' into the opposing softer bump during bonding. This constrains the lateral movement of the two bumps relative to each other and reduces lateral slippage. In some embodiments, the auxiliary bumps and interconnect bumps are formed in the same process, and also bonded in the same process.