Saratoga, CA, United States of America

Nachiket Raghunath Raravikar

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Nachiket Raghunath Raravikar

Introduction

Nachiket Raghunath Raravikar is a notable inventor based in Saratoga, CA. He has made significant contributions to the field of bonding technologies, particularly in the area of ultra-dense bump arrays. His innovative approach has led to advancements that enhance the stability and efficiency of bonding processes in semiconductor applications.

Latest Patents

Raravikar holds a patent titled "Bonding ultra-dense bump arrays using alignment bumps." This patent introduces the use of additional 'auxiliary' bumps to stabilize alignment and reduce slippage of dense arrays of interconnect bumps on opposing die during the bonding process. One of the key features of this invention is the use of interdigitated bumps, which are designed to be more self-aligning and laterally stable. In this configuration, the head of a bump on one die fits into the space between bumps on the other die, preventing head-to-head contact. Another innovative aspect of his patent involves nail bumps, where one bump is harder and 'drives' into the opposing softer bump during bonding, constraining lateral movement and reducing slippage.

Career Highlights

Raravikar is currently employed at Tectus Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing bonding techniques that are crucial for the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Arnold Daguio and Kwong-Hin Henry Choy. Their collaborative efforts contribute to the innovative environment at Tectus Corporation, fostering advancements in bonding technologies.

Conclusion

Nachiket Raghunath Raravikar's contributions to the field of bonding technologies exemplify the impact of innovative thinking in the semiconductor industry. His patent on bonding ultra-dense bump arrays showcases his commitment to enhancing the efficiency and stability of bonding processes.

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