Tectus Corporation

Nachiket Raghunath Raravikar

Paul Scott Martin

Kwong-Hin Henry Choy

Tigran Nshanian

Arnold Daguio

Additional 'auxiliary' bumps are used to stabilize alignment and reduce slippage of dense arrays of interconnect bumps on opposing die during a bonding process. One example of auxiliary bumps are interdigitated bumps. Interdigitated bumps are more self-aligning and laterally stable because bumps do not meet head-to-head. Rather, the head of a bump on one die falls into the space between bumps on the other die. Another example of auxiliary bumps are nail bumps. In nail bumps, one bump is harder (the nail) and 'drives' into the opposing softer bump during bonding. This constrains the lateral movement of the two bumps relative to each other and reduces lateral slippage. In some embodiments, the auxiliary bumps and interconnect bumps are formed in the same process, and also bonded in the same process.

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Saratoga, CA, United States of America

Nachiket Raghunath Raravikar