Arnold Daguio

Title: Arnold Daguio: Innovator in Bonding Technologies and LED Structures

Introduction

Arnold Daguio is a notable inventor based in Gilroy, CA (US). He has made significant contributions to the fields of bonding technologies and LED structures. With a total of 2 patents, Daguio's work showcases innovative solutions that enhance the performance and reliability of electronic components.

Latest Patents

Daguio's latest patents include "Bonding ultra-dense bump arrays using alignment bumps" and "Robust LED structure for substrate lift-off." The first patent addresses the challenges of stabilizing alignment and reducing slippage of dense arrays of interconnect bumps during the bonding process. It introduces auxiliary bumps, such as interdigitated bumps and nail bumps, which improve the self-alignment and stability of the bonding process. The second patent focuses on a method for singulating LEDs from a substrate while ensuring that the phosphor plate can be easily positioned on top of the LED die, thanks to the innovative underfill material and laser lift-off technique.

Career Highlights

Throughout his career, Arnold Daguio has worked with prominent companies, including Philips Lumileds Lighting Company LLC and Koninklijke Philips Corporation N.V. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of lighting and electronic components.

Collaborations

Daguio has collaborated with talented individuals such as Qingwei Mo and Nachiket Raghunath Raravikar. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Arnold Daguio's contributions to bonding technologies and LED structures demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the challenges faced in electronic component manufacturing and provide effective solutions that enhance performance.