Tiffany Byrne

Title: Tiffany Byrne: Innovator in Semiconductor Technology

Introduction

Tiffany Byrne is a prominent inventor based in Chandler, AZ (US). She has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. Her work focuses on improving processes and formulations related to semiconductor wafer coat layers.

Latest Patents

One of Tiffany's latest patents involves semiconductor wafer coat layers and methods for their application. This patent discloses formulations and processes for forming wafer coat layers. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation that is deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps, preventing oxidation of the bumps between die preparation and chip attachment. Additionally, an alternative embodiment includes the addition of an ultraviolet light absorber to enhance the wafer coat layer's energy absorption, thereby improving the laser's ability to ablate the wafer coat layer. Another embodiment describes a conformal wafer coat layer deposited on the wafer and die bumps, which reduces thickness variations that can impact the laser scribing ability.

Career Highlights

Tiffany Byrne is currently employed at Intel Corporation, where she continues to innovate in semiconductor technologies. Her work has been instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Tiffany collaborates with notable colleagues, including Eric Jin Li and Daoqiang Lu, who contribute to her research and development efforts.

Conclusion

Tiffany Byrne is a key figure in the semiconductor industry, with her innovative patents and contributions significantly impacting the field. Her work at Intel Corporation exemplifies her commitment to advancing technology and improving manufacturing processes.